Amtech Systems Inc. (ASYS)
Company Description
Amtech Systems, Inc. manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide (SiC), silicon power devices, analog and discrete devices, electronic assemblies, and light-emitting diodes (LEDs) worldwide.
The company operates in Semiconductor and Material and Substrate segments.
The Semiconductor segment designs, manufactures, sells, and services thermal processing equipment, including solder reflow ovens, diffusion furnaces, and customer high-temp belt furnaces for use by semiconductor manufacturers, as well as in electronics, automotive and other industries; and wafer polishing equipment and related services.
Its products include horizontal diffusion furnaces; and belt furnaces.
The Material and Substrate segment manufactures and sells consumables and machinery for lapping and polishing of materials, such as silicon wafers for semiconductor products; sapphire substrates for LED lighting and mobile devices; silicon carbide wafers for LED and power device applications; various glass and silica components for 3D image transmission; quartz and ceramic components for telecommunications devices; and medical device components, and optical and photonics applications.
This segment also offers substrate process chemicals for use in various manufacturing processes, including semiconductors, silicon and compound semiconductor wafers, and optics.
The company sells its products through sales personnel, as well as a network of independent sales representatives and distributors.
The company was formerly known as Quartz Engineering & Materials, Inc. and changed its name to Amtech Systems, Inc. in 1987.
Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.

Country | United States |
IPO Date | Aug 9, 1983 |
Industry | Semiconductors |
Sector | Technology |
Employees | 328 |
CEO | Robert C. Daigle |
Contact Details
Address: 131 South Clark Drive Tempe, Arizona United States | |
Website | https://www.amtechsystems.com |
Stock Details
Ticker Symbol | ASYS |
Exchange | NASDAQ |
Fiscal Year | October - September |
Reporting Currency | USD |
CIK Code | 0000720500 |
CUSIP Number | 032332504 |
ISIN Number | US0323325045 |
Employer ID | 86-0411215 |
SIC Code | 3559 |
Key Executives
Name | Position |
---|---|
Robert C. Daigle | President, Chairman & Chief Executive Officer |
Wade Michael Jenke | Secretary, Vice President & Chief Financial Officer |
Angi Larson | Chief Human Resources Officer |
Jason Brown | Vice President of Operations |
Paul Lancaster | Vice President of Sales & Corporate Development |
Shashi Gupta | Senior Vice President & GM of Semiconductor Fabrication Solutions |
Latest SEC Filings
Date | Type | Title |
---|---|---|
Mar 21, 2025 | 4 | Filing |
Mar 19, 2025 | S-8 | Filing |
Mar 12, 2025 | 4 | Filing |
Mar 07, 2025 | 4 | Filing |
Mar 07, 2025 | 4 | Filing |
Mar 07, 2025 | 4 | Filing |
Mar 07, 2025 | 4 | Filing |
Mar 07, 2025 | 8-K | Current Report |
Mar 05, 2025 | 4 | Filing |
Feb 24, 2025 | DEFA14A | Filing |