BE Semiconductor Industri... (BESIY)
Company Description
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide.
The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.
Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services.
The company's principal brand names include Datacon, Esec, Fico, and Meco.
It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.
The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Country | NL |
IPO Date | Dec 5, 1995 |
Industry | Semiconductors |
Sector | Technology |
Employees | 1,820 |
CEO | Richard W. Blickman |
Contact Details
Address: Ratio 6 Duiven, NL | |
Website | https://www.besi.com |
Stock Details
Ticker Symbol | BESIY |
Exchange | PNK |
Fiscal Year | January - December |
Reporting Currency | USD |
CIK Code | n/a |
CUSIP Number | 073320103 |
ISIN Number | US0733201034 |
Employer ID | - |
SIC Code | n/a |
Key Executives
Name | Position |
---|---|
Richard W. Blickman | Chairman of Management Board, President & Chief Executive Officer |
Andrea Kopp-Battaglia | Senior Vice President of Finance |
Chris Scanlan | Senior Vice President of Technology |
Christoph Scheiring | Senior Vice President of Die Attach |
Edmond Franco | Vice President of Corporate Development |
Henk-Jan Jonge Poerink | Senior Vice President of Global Operations |
Jeroen Kleijburg | Senior Vice President of Packaging |
Jong Kwon Park | Senior Vice President of Sales & Customer Support - APAC |
Peter Wiedner | Senior Vice President of Sub Micron Die Attach |
Rene W. Hendriks | Senior Vice President of Sales - North America & Europe |